Electroplating Kinetics of a Nickelframe0Tungsten Alloy |
18.09.2008 г. |
Electroplating Kinetics of a NickelTungsten Alloy V. L. Kotov and M. V. Shmukler Ivanovo State Chemical-Technological University, pr. Engelsa 7, Ivanovo, 153460 Russia e-mail:
Этот e-mail защищен от спам-ботов. Для его просмотра в вашем браузере должна быть включена поддержка Java-script
Received March 17, 2004 Abstract — Electroplating a nickel–tungsten alloy under various electrolysis conditions (direct and alternating current) is studied. A radical–film mechanism of the alloy formation by the cathodic deposition is experimentally proved. The effect of sorption processes at the film–electrolyte boundary on the alloy formation, as well as the possibility of controlling the film composition and structure by changing the electric field intensity, is studied. Deposits with a content of the high-melting component of up to 61% are obtained.
|