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Electrodeposition of Copper-Containing Polymer Coatings from Sulfate Electrolytes Containing N-Methylpyrrolidone V. V. Kuznetsov*, L. M. Skibina*, E. F. Kuznetsova*, I. N. Loskutnikova**, and A. I. Sokolenko** * Department of Chemistry, Rostov State University, ul. Zorge 7, Rostov-on-Don, 344090 Russia e-mail:
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** Don State Technical University, Russia Received November 23, 2004 Abstract — In sulfate electrolytes for copper plating, N-methylpyrrolidone (MP) was found to form stable 2 : 1 complexes with the metal. The nature of electroactive species at the copper cathode depends on the MP concentration. In a concentration range from 10–4 to 10–2 mol/l, the electrode reaction involves complexes of discharging metal ions with adsorbed MP molecules, the complexes being formed in the surface layer. At higher MP concentrations, a slow chemical step associated with dissociation of complex species in the bulk of the solution precedes ion discharge. The inhibitive effect of MP on copper electrodeposition is due to adsorbed MP molecules at the electrode; the adsorption value determines the efficiency of the additive and the wear resistance of the coating.
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