Electroplating Kinetics of a Nickel
Tungsten Alloy
V. L. Kotov and M. V. Shmukler
Ivanovo State Chemical-Technological University, pr. Engelsa 7, Ivanovo, 153460 Russia
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Received March 17, 2004
Abstract — Electroplating a nickel–tungsten alloy under various electrolysis conditions (direct and alternating current) is studied. A radical–film mechanism of the alloy formation by the cathodic deposition is experimentally proved. The effect of sorption processes at the film–electrolyte boundary on the alloy formation, as well as the possibility of controlling the film composition and structure by changing the electric field intensity, is studied. Deposits with a content of the high-melting component of up to 61% are obtained.